(Dec. 19th 2007, Beijing ) Innofidei Inc. and TSMC announced today that IF101£¬the first CMMB demodulator chip designed by INNOFIDI, will soon be manufactured with big scale by TSMC. According to the schedule of CMMB operation in 2008 by SARFT, the chips will meet the demand from large number of CMMB terminals before 2008 Beijing Olympic Games.

In accordance to the cooperative agreement, in the coming half year, TSMC will manufacture millions of IF101 chips with advanced 12-inch wafer technologies, mainly to meet the demand from large number of CMMB terminals when the 37-cities CMMB trial net is build up by SARFT.

The chip to be manufactured is the optimized version on the basis of the one released in March this year. Compared to the old version, the chip has lower power (about 1/3 lower); higher sensibility and stronger high-speed move ability, which will not only exceed the demands from CMMB terminals, but also improve the performance of terminals, such as stand-by time and receive quality. Up till now, INNOFIDEI has had about 50 strategic partners from terminal filed, including Lenovo, Aigo, Techfaith, UT Starcom, ZTE and moto, etc.

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry. As the founder and leader of this industry, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. We are confident that the cooperation between INNOFIDEI and TSMC will promote the industrialization of IF101 and CMMB operation in 2008!

About INNOFIDEI£º(www.innofidei.com)
Founded in 2006 in Beijing Z-Park with operations in Beijing, Silicon Valley and Taipei, Innofidei dedicates itself to provide enabling IC and system solutions for the mobile TV broadcast market.

Innofidei combines both proven management team and technical team together. The two founders are both proven entrepreneurs with world class talent and local knowledge base. They are on their second chip venture both. And the company has put together a very strong team bringing international chip experience to the domestic China market. The technical team members were previously at prestigious IC companies such as Broadcom, LSI, ATI, Philips, QualComm etc.

The company owns strong technical competencies. Algorithm and Broadcast transmitter system solutions are two key areas we are leading the competition in, to help us to secure our dominance in the markets and defining the system so our customers will follow. The low power VLSI and RF/Mixed-signal technologies are to enable us to get a competitive low-power and low-cost chip product.

As a fabless semiconductor company that designs high-performance chipsets, so far the company is the only chip company gets funding from SARFT to develop both receiver and transmitter chips, which demonstrates the strong regulatory support we get from the government authorities.

Innofidei has also built up close partnership with companies in the industry chain. The partners include ABS, Analog Devices, Huaqi, Lenovo, TechFaith, UTStarcom and ZTE.

About TSMC£º(www.tsmc.com)
Established in 1987, TSMC is the world's largest dedicated semiconductor foundry. As the founder and leader of this industry, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry industry's leading technologies to its customers. The company's manufacturing capacity exceeds 7 million 8-inch equivalent wafers in 2006, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry.

In 2002, TSMC became the first semiconductor foundry to enter the ranks of the top 10 IC companies in terms of worldwide sales. It continues to move up and is ranked number sixth in 2006 according to the IC insight research report on March 15, 2007.

As the first dedicated foundry, TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, due to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

TSMC operates two advanced 300mm wafer fabs, four 8-inch wafer fabs, and one 6-inch wafer fab. Fab operations are centralized in Taiwan, primarily in the Hsinchu Science Park and the Tainan Science Park. TSMC fabs are also located in Camas, Washington (WaferTech), Singapore (SSMC, a joint venture with NXP Semiconductors), and Shanghai, China.

TSMC's headquarters is located in the Hsinchu Science Park, with account management and engineering service offices in China, India, Japan, Korea, the Netherlands, Taiwan and the United States. The company is listed on the Taiwan Stock Exchange (TSE) and on the New York Stock Exchange (NYSE) under the trading symbol of TSM.