WMC2009 was grandly held in Barcelona from Feb. 16th. Due to its achievements in TD-LTE R&D, Innofidei attended WMC2009 for the first time and announce the development of TD-LTE base-band chip design.
    As the core chip company of CMMB, Innofidei has an excellent R&D team to release the worldly first CMMB chip and then promote the whole industry. Innofidei started its TD-LTE project by the end of 2007. Now significant progresses have already been made in all areas.

    Although for the first time, Innofidei attend WMC2009 together with CMCC and TDIA. At the booth of TDIA, Innofidei made the first TD-LTE high-resolution video demo based on its base band chip design. Innofidei also attend the TD-LTE summit hosted by CMCC, to draw the attention of famous operators such as Vodafone.

    TD-LTE Design by Innofidei:
Design phases:
-        FPGA/DSP based prototype: 3gpp 2008.09 version or later
-        FD/FDD single mode ASIC: Up-to-date version
-        LTE/TS-SCDMA/EDGE multi-mode ASIC
Features
-        Support category 3 UE capability
-        20MHz, support 100Mbps DL and 50Mbps UL
-        Support SIMO, Transmit Diversity, 2x2 MIMO beam-forming and close-loop/open loop spatial multiplexing
-        Support HARQ, adaptive modulation and coding
-        Support speed up to 350 km/hr, good performance for speed up to 120km/hr optimized for 15 km/hr
-        Support coverage up to 100 km, good performance for coverage up to 30 km, optimized for coverage of 5km